Circuit package

ABSTRACT

A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

CROSS REFERENCE TO RELATED APPLICATION

The present application is a divisional of U.S. patent application Ser.No. 15/544,798, filed on Jul. 19, 2017, which is a U.S. National Stageunder 35 U.S.C. § 371 of International Patent Application No.PCT/US2015/23020, filed Mar. 27, 2015, the disclosures of which arehereby incorporated herein by reference.

BACKGROUND

Circuits such as integrated circuits are oftentimes packaged in an epoxymold compound packaging to support and protect the circuitry. Dependingon the manufacturing method used, it may be difficult to controldimensions, shapes or certain properties of packaged circuits.

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of illustration, certain examples constructed inaccordance with this disclosure will now be described with reference tothe accompanying drawings, in which:

FIG. 1 illustrates a diagram of an example circuit package.

FIG. 2 illustrates a diagram of another example circuit package.

FIG. 3 illustrates a diagram of another example circuit package.

FIG. 4 illustrates a diagram of another example circuit package.

FIG. 5 illustrates a diagram of another example circuit package.

FIG. 6 illustrates a diagram of another example circuit package.

FIG. 7 illustrates a diagram of another example circuit package.

FIG. 8 illustrates a diagram of an example fluid circuit package in across sectional side view.

FIG. 9 illustrates a diagram of an example fluid circuit in a top view.

FIG. 10 illustrates a flow chart of an example method of compressionmolding a circuit package.

FIG. 11A illustrates a diagram of an example circuit and packagematerials before compression molding.

FIG. 11B illustrates a diagram of an example circuit package aftercompression molding the circuit and package materials of FIG. 11 a.

FIG. 12 illustrates a flow chart of an example method of forming aB-staged sheet mold.

FIG. 13 illustrates a flow chart of another example method of forming aB-staged sheet mold.

FIG. 14 illustrates a flow chart of another example method ofcompression molding a circuit package.

FIG. 15 illustrates a diagram of an example of an extrusion tool andresulting example B-staged sheet molds.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings. The examples in the description and drawingsshould be considered illustrative and are not intended as limiting tothe specific example or element described. Multiple examples can bederived from the following description and drawings throughmodification, combination or variation of the different elements.

FIG. 1 illustrates an example of a circuit package 1. The circuitpackage 1 includes a circuit device 3 and a packaging 5. The packaging 5serves to support and protect the circuit device 3. In an exampleadditional circuitry may run through the packaging 5, connected to thecircuit device 3. The packaging 5 comprises a first epoxy mold compound7 with a first CTE (Coefficient of Thermal Expansion) and a second epoxymold compound 9 with a second CTE that is higher than the first CTE. Thesecond epoxy mold compound 9 is disposed adjacent to the circuit device3, for example so as to influence a bow near a package face thatincludes the circuit device 3.

In one example, the circuit package 1 is substantially panel-shaped. Thepanel-shaped circuit package 1 may have a front surface F and a backsurface B. Both the circuit device 3 and the second epoxy mold compound9 extend near the front surface F. In the illustrated example, thesecond epoxy mold compound 9 extends in the same plane X-Y as thecircuit device 3, wherein the plane X-Y extends parallel to the frontand back surface F, B of the panel, and near the front surface F. Forexample, most of the volume of the package 5 is formed by the firstepoxy mold compound 7. In the illustrated example, the first epoxy moldcompound 7 extends below the second epoxy mold compound 9 up to the backsurface B.

The circuit package 1 has a panel shape in the sense that it has athickness T, between a back and front surface B, F, that is much lessthan its width W or length. For example its thickness T can be at leastfive times, or at least ten times its width W and/or length (in thedrawing, the length extends into the page). In the drawing, thethickness extends in a Z-direction while the length and width W extendparallel to the X-Y plane.

The circuit device 3 may include metal and/or semi-conductor componentssuch as silicon. The circuit device 3 has a lower CTE than the firstepoxy mold compound 7. In an example the circuit device 3 includesapproximately 3.1 parts per million per ° C. rise in temperature(ppm/C).

In certain examples the circuit package 1 is manufactured by compressionmolding. In again further examples, before compression molding thecircuit devices 3 in the packaging 5, the epoxy mold compounds areprovided in granular, powder, layered and/or B-staged sheet form.Compression molding may involve heating the layers, sheets or granularepoxy mold compounds in a mold, compressing the circuit devices andcompounds to form the package 1, and cooling the package 1. In certainexamples, the circuit devices comprise conductor and/or semi-conductormaterials. Hence, the thermal expansion of the circuit device 3 and thethermal expansion of the first epoxy mold compound 7 are different.Thus, warpage could occur during cooling, if the circuit device 3 wouldbe packaged in the first epoxy mold compound only.

In some of the examples of this disclosure, a second epoxy mold compound9 with an even higher CTE is deposited adjacent to the circuit device 3to control said warpage or bow. For example, the second epoxy moldcompound 9 is disposed in a strategic quantity (e.g. thickness, surface)and location near the circuit device 3, so as to influence an overallCTE of a “composite” portion of the package 1 that incorporates both thecircuit device 3 and the second epoxy mold compound 9, near the frontsurface F. For example the CTE of the composite portion is such that thethermal expansion of the composite portion compensates for the thermalexpansion of the opposite back portion that may substantially consist ofthe first epoxy mold compound 7.

In certain examples, when a circuit device is packaged in a single epoxymold compound, the resulting circuit package may curve into a shape thatis convex at the front surface F where the circuit device is located,and concave at the opposite, back surface B. To counter such undesiredcurving, a thin layer of a second epoxy mold compound 9 with a higherCTE than the first epoxy mold compound 7 can be disposed near thecircuit devices 3. By disposing a layer of the second epoxy moldcompound, an overall thermal expansion (or shrinking) of the compositelayer during cooling may be similar, or of inverse shape, as the thermalexpansion near the back surface B. Thereby the layer of the second epoxymold compound may compensate for the deformation near the back surface.Positions, shapes and quantities of the second epoxy mold compound 9 andthe first epoxy mold compound 7 can be varied to control a bow orwarpage of the circuit package 1. By having a better control over panelbow in compression molded circuit packages, certain design constraintscan be relieved, such as circuit device thickness (versus length andwidth), number of circuit devices in a packaging, packaging thickness,mold temperature settings, substrate handling downstream of acompression mold such as an electrical redistribution layer (RDL)fabrication process, packaging clamping during cooling, and more.Further example circuit packages are described below.

FIG. 2 illustrates another example circuit package 101. The circuitpackage 101 may be panel shaped and includes a packaging 105 and acircuit device 103. The circuit package 101 includes a relatively thinsecond layer of a second epoxy mold compound 109 that is disposed over afirst layer of a first epoxy mold compound 107. The second epoxy moldcompound 109 has a higher CTE than the first epoxy mold compound 107.The second epoxy mold compound 109 may have a lower filler density thanthe first epoxy mold compound 107. The circuit device 103 extends in ornear a front surface F. The second layer of the second epoxy moldcompound 109 extends in the same plane X-Y as the circuit device 103.The plane X-Y extends parallel to the front surface F and a back surfaceB of the circuit package 101, near the front surface F. In one example,the first epoxy mold compound 107 forms the bulk of the packaging 105and forms the back surface B of the packaging 105.

In the illustrated example, the second layer of the second epoxy moldcompound 109 is thinner than a height of the circuit device 103 so thata front portion 111 of the circuit device 103 extends in the secondepoxy mold compound 109 while a back portion 113 of the circuit device103 extends in the first epoxy mold compound 107 that extends below thesecond epoxy mold compound 109. During compression molding, the circuitdevice 103 may be deposited into and partly through the second epoxymold compound 109 so that the back portion 113 sits in the first epoxymold compound 107. This example may work where only a thin slice of thehigh CTE epoxy mold compound 109 is desired to control panel bow.

FIG. 3 illustrates another example circuit package 201. The circuitpackage 201 may be panel shaped and includes a packaging 205 and acircuit device 203 in the packaging 205. The circuit package 201 has afront and back surface F, B, respectively. The packaging 205 includeslayers of a first epoxy mold compound 207 of a first CTE and a secondepoxy mold compound 209 of a second CTE higher than the first CTE. Thelayer of the second epoxy mold compound 209 extends near the circuitdevice 203 and near the front surface F, parallel to a plane X-Y throughthe circuit device 203. In the drawing, the second epoxy mold compound209 extends under the circuit device 203 and under the plane X-Y. Twolayers 207A, 207B of the first epoxy mold compound 207 extends along thefront and back side, respectively, of the second epoxy mold compound209. A relatively thin layer 207A of the first epoxy mold compound 207extends in the same plane X-Y as the circuit device 203, at the frontsurface F and parallel to the front surface F. In the example, thecircuit device 203 is fully deposited in that layer 207A of the firstepoxy mold compound 207. A back layer 207B of the first epoxy moldcompound 207, which may represent most of the volume of the packaging205, extends on the opposite side of the second epoxy mold compound 209,at the back of the packaging 205. As a result, the overall panel warpagecan be controlled or reduced, relative to a package of a single epoxycompound.

In the example of FIG. 3, the second epoxy mold compound 209 maycompensate for a bow that could otherwise be caused by the differentCTEs of the circuit device 203 and the first epoxy mold compound 207.For example, the second epoxy mold compound 209 is close enough to thefront surface F and/or circuit devices 203 to influence an overallthermal expansion near the front surface F, to compensate for thethermal expansion near the back surface B of the compression moldedpackage 201.

In another example that is similar to FIG. 3, the front first epoxy moldcompound layer 207A may be thinner and the second epoxy mold compoundlayer could be moved upwards so that it touches the circuit device 203.A back portion 213 of the circuit device 203 would then be disposed inthe second epoxy mold compound 209 and a front portion of the circuitdevice 203 in the first epoxy mold compound 207.

FIG. 4 illustrates another example of a circuit package 301. The circuitpackage 301 includes a circuit device 303 and a packaging 305. Thepackaging 305 includes a first epoxy mold compound 307 near a backsurface B and a second epoxy mold compound 309 near a front surface F,wherein the second epoxy mold compound 309 has a higher CTE than thefirst epoxy mold compound 307. The second epoxy mold compound 309 isdisposed in a plane X-Y that extends through the circuit device 303parallel to the front and back surface F, B of the package 301, near thefront surface F. The first epoxy mold compound 307 is disposed near aback surface B.

The CTE of the packaging 305 decreases gradually, for example in stepsor layers A, B, from a front surface F to a back surface B. The CTE candecrease in a direction G away from a circuit device layer 315, forexample in a direction G perpendicular to said plane X-Y through thecircuit devices 303. In other examples, as illustrated with dottedarrows G, G1, the epoxy mold compounds 307, 309 are disposed in thepackaging 305 so that the CTE decreased in multiple directions G, G1away from the circuit device 303. In an example the packaging 305contains 100% first epoxy mold compound of a first CTE near the backsurface B and 100% second epoxy mold compound of a second CTE near thefront surface F.

FIG. 5 illustrates an example of a circuit package 401, including apackaging 405 and a circuit device 403. The circuit package 401 includesan array 417 of circuit devices 403 in a circuit device layer 415. Thecircuit device layer 415 may be provided near a front surface F of thecircuit package 401. In the circuit device layer 415, the circuitdevices 403 of the array 417 extend next to each other, for example incolumns and/or rows. In the example, the circuit devices 403 extend upto the front surface F.

The packaging 405 includes a first epoxy mold compound 407 and a secondepoxy mold compound 409 having a higher CTE than the first compound. Inthe illustrated example, the first epoxy mold compound 407 forms a backportion of the packaging 401 near a back surface B. The first epoxy moldcompound 407 may form the bulk of the material of the packaging 405. Thesecond epoxy mold compound 409 extends near the front surface F in thesame plane X-Y as the circuit device array 417.

The circuit device array 417 may be applied to each of the examples ofthis description. For example, each of the individual circuit devices 3,103, 203, 303 of each of the examples of FIG. 1-4 could actually be anarray 417 of circuit devices as in FIG. 5 wherein the array 417 extendsin the respective first and/or second epoxy mold compound layer.

FIGS. 6 and 7 illustrate different examples of circuit packages 501,601, wherein the second epoxy mold compound 509, 609 of higher a CTE ispatterned in a first epoxy mold compound 507, 607, in a plane X-Ythrough the circuit devices 503, 603 near the front surface F. Here, apattern may be interpreted as the second epoxy mold compound 509, 609spanning a selective portion of a panel surface only. Here, the firstepoxy mold compound 509, 609 spans the entire panel surface. In FIG. 6,the circuit devices 503 are disposed in the second epoxy mold compound509. In FIG. 7, the circuit devices 603 are disposed in the first epoxymold compound 607 and the second epoxy mold compound 609 extends next tothe circuit array 617 and next to and on top of the first epoxy moldcompound 607. In both examples, the second epoxy mold compound 509, 609extends near the circuit devices 503, 603, in a circuit device layer515, 615, and may thereby compensate for potential bow that couldotherwise be incurred by the different thermal expansions between thecircuit device array 517, 617 and the first epoxy mold compound 507,607.

FIGS. 8 and 9 illustrate a panel-shaped fluidic circuit package 701 in across sectional side view and in a top view, respectively. The fluidiccircuit package 701 includes a packaging 705 of a first and second epoxymold compound 707, 709, respectively, wherein the second epoxy moldcompound 709 has a higher CTE than the first epoxy mold compound 707. Anarray 717 of fluidic circuit devices 703 is disposed in a circuit devicelayer 715 near a front surface F. In this example the circuit devicelayer 715 defines the front surface F.

The fluid circuit package 701 may be a component of a high precisiondigital liquid dispensing module such as a media wide array print barfor two-dimensional or three-dimensional printing. The fluid circuitdevices 703 may be shaped like relatively thin slivers, and may includesilicon material. Each of the circuit devices 703 includes channels 719to transport fluid (FIG. 8). In an example the fluid circuit devices 703include nozzles at respective ends of the channels 719. Certainactuators such as resistors may be disposed in the channels 719 near thenozzles, for example in respective chamber portions of the channels.Arrays 721 of nozzles may open into the front surface F (FIG. 9). Anozzle density of one row of nozzles may for example be at leastapproximately 300 nozzles per inch, at least 600 nozzles per inch, atleast 900 nozzles per inch, at least 1200 nozzles per inch, or more. Inan example, each fluid circuit device 703 is provided with at least twonozzle arrays 721. Besides being relatively thin, in a further example,the fluid devices 703 have a relatively small width W and long length L.For example a ratio of length L versus width W may be at leastapproximately 25:1 or at least 50:1. The fluid circuit devices 703 maybe arranged in two rows R so that subsequent nozzle arrays 721 inopposite rows R overlap so as to have continuous coverage of nozzlearrays as seen from a side direction D perpendicular to said length L ofthe fluid circuit devices 703, as best illustrated by FIG. 9.

The packaging 705 includes through bores in the form of fluid holes 723to deliver fluid to each of the fluid circuit devices 703. In anexample, average cross-sectional diameters of the fluid holes 723 arelarger than the average cross sectional diameters of the fluid channels719 of the devices 703. The fluid holes 723 open into the back surface Bof the packaging 705 and lead to each of the fluid circuit devices 703.An array 723A of fluid holes 723 may extend into the drawing, parallelto each of the nozzle arrays 721, as illustrated by a dotted line in oneof the circuit devices 703 in FIG. 9. One row of fluid holes 723 mayguide fluid to two nozzle arrays 721. The fluid holes 723 may open in toa manifold channel that leads to both nozzle arrays 721.

In an example, most of the length Lf of the fluid holes 723 extendthrough the first epoxy mold compound 707. For example, the fluid holes723 extend entirely in the first epoxy mold compound 707. In anotherexample, a final portion of the fluid holes 723, near the circuitdevices 703, extend through the second epoxy mold compound 709.

FIG. 10 illustrates a flow chart of an example of a method ofcompression molding. The example method is further illustrated indiagrammatic drawings in FIGS. 11A and 11B. Below, block numbers referto the flow chart of FIG. 10 and reference numbers refer to the drawingsof FIGS. 11A and 11B. The method of compression molding includesdepositing at least two epoxy mold compounds 807, 809 of differentcompositions over a mold cavity 825 (block 100, FIG. 11A). In oneexample, the each of the epoxy mold compounds involve granular epoxymold compounds. In one example the different compositions may involvedifferent filler densities and different CTEs. The method furtherincludes heating the compounds 807, 809 (block 110, FIG. 11A) in thecavity. The method further includes depositing at least one circuitdevice 803 in at least one of the epoxy mold compounds 807, 809 (block120, FIG. 11B). The circuit device 803 may be deposited in the epoxymold compounds 807, 809 while compressing the epoxy mold compounds 807,809 (block 130). The method further includes cooling the circuit device803 and the epoxy mold compounds 807, 809 (block 140, FIG. 11B).

FIG. 11A illustrates a mold cavity 825 with two layers of epoxy moldcompound 807, 809, for example granular epoxy mold compounds 807, 809,placed in the mold cavity 825. In the illustrated example, a layer of asecond epoxy mold compound 809 with a higher CTE is placed over a layerof a first epoxy mold compound 807 with a lower CTE. The layer of thefirst epoxy mold compound 807 may be thicker than the layer of thesecond epoxy mold compound 809. A mold tool 829 is to deposit thecircuit devices 803 into to the heated second epoxy mold compound 809while compressing the epoxy mold compound. In a further example, atleast one mold tool 829 is to deposit multiple layers of different epoxymold compounds of different compositions. In different examples, themold tool can dispense different layer thicknesses, layer sequences, andpattern the compounds in an X-Y plane X-Yerpendicular to the extrusiondirection, such as in the examples of FIGS. 6 and 7.

FIG. 11B illustrates a panel-shaped, cooled circuit package 801 whereinthe circuit devices 803 have been deposited in the second epoxy moldcompound 809. A back portion BP of the circuit package 803 is formed bythe first epoxy mold compound 807. Most of the volume of the circuitpackaging 805 is formed by the first epoxy mold compound 807.

FIGS. 12 and 13 illustrate a flow chart of an example of a method ofmanufacturing b-staged sheets of epoxy mold compounds, each sheet havinga varying filler density over its cross section. FIG. 14 illustrates aflow chart of an example of a method of sheet compression molding acircuit package of this disclosure using B-staged sheets of one of theexample methods of FIGS. 12 and 13. FIG. 15 illustrates an extrusiontool to manufacture B-staged sheets and corresponding examples ofB-staged sheets.

In the example method of FIG. 12, a heated first epoxy mold compound ofa first filler density is extruded through a first extrusion head, tobuild a first layer of the first epoxy mold compound (block 300).Subsequently or concurrently, a heated second epoxy mold compound of asecond filler density, different than the first filler density, isextruded through a second extrusion head to build a second layer of thesecond epoxy mold compound (block 310). For example compression orcooling may be applied to the combined layers. The two layers then forma B-staged sheet of epoxy mold compound layers of varying fillerdensities in a thickness or Z-direction (see FIG. 15) (block 320). Forcomparison, examples of a first and second extrusion head 935, 937 andB-staged sheets 905A, 905B, 905C having varying filler densities in aZ-direction are illustrated in FIG. 15. In other examples more than twoepoxy mold compound layers of different filler densities can be stackedto form a B-stage sheet having a filler density gradient in aZ-direction.

Another example method of forming a B-staged sheet of epoxy moldcompound having varying filler densities is illustrated in FIG. 13. InFIG. 13, a first powder of a first epoxy mold compound of a first fillerdensity is dispensed (block 400). Subsequently or concurrently, a secondpowder of a second epoxy mold compound of a second filler density,different than the first filler density, is dispensed over or in thefirst epoxy mold compound (block 410). The powders of different fillerdensities may then be compressed and/or cooling to form a B-staged sheetof an epoxy mold compound having a varying filler densities in at leastone direction (block 420), for example a thickness or Z-direction.

FIG. 14 illustrates an example of a method of compression molding acircuit package using B-staged epoxy mold compound sheets of varyingfiller densities. As said, in this disclosure, a filler density mayrefer to a weight percentage of fillers. The example method includespositioning a B-staged sheet of epoxy mold compound having varyingfiller densities in at least one direction in a mold cavity (block 200).The method further includes heating the sheet in the mold cavity (block210). The method further includes depositing at least one circuit devicein the sheet (block 220). For example, the circuit device is depositednear a front side of the sheet near layers of a relatively low fillerdensity, opposite to a backside that has a relatively high fillerdensity. The method may further include compressing and cooling thecompounds and circuit device so as to form a circuit package (block230).

FIG. 15 illustrates a diagram of an example of first and second epoxymold compound extrusion heads 935, 937, respectively, to form B-stagedsheets 905, 905B, 905C of epoxy mold compound having varying fillerdensities. These “sheets” are also known in industry as “sheet molds”.Each sheet 905A, 905B, 905C may include a first layer of a first epoxymold compound 907 and a second layer of a second epoxy mold compound909, wherein the first epoxy mold compound 907 has a higher fillerdensity and/or lower CTE than the second epoxy mold compound 909.

A first extrusion head 935 may be arranged to dispose a first epoxy moldcompound 907 with a relatively high filler density and/or relatively lowCTE. A second extrusion head 937 may be arranged to dispose a secondepoxy mold compound 909 with a relatively low filler density and/orrelatively high CTE, for example over the first epoxy mold compound 907.The extrusion heads 935, 937 may be arranged to dispose the epoxy moldcompounds 907, 909 in layers. Further extrusion heads may be provided todispense more layers of different filler densities or the same extrusionheads may dispense further layers of again different filler densities.In the example, the layers 907, 909 are stacked in a direction parallelto a Z-axis Z. In certain examples not illustrated here, certainpart-layers of a second compound may be patterned within part-layers ofa different compound of different filler density and/or CTEs (see forexample FIG. 6 or 7) before forming the B-stage sheet 905A, 905B, and905C.

In a first example, a sheet 905A includes a relatively thin second layerof a second epoxy mold compound 909 over a first layer of a first epoxymold compound 907. In this example the circuit devices may be depositedin the second layer 909. In a second example, a packaging 905B includesa relatively thin first layer of a first epoxy mold compound 907 that isdeposited over an again relatively thin second layer of a second epoxymold compound 909 that in turn is disposed over a relatively thick firstlayer of a first epoxy mold compound 907, the latter near a back side.In this example the circuit devices are deposited in the relatively thinfirst layer 907 at a front side, on the opposite side of the relativelythick first layer 907 at the back side. In a third example, a packaging905C includes layer of a second epoxy mold compound 909 near a frontside and a layer a first epoxy mold compound 907 at a back side. Betweenthe layer of the second epoxy mold compound and the layer of the firstepoxy mold compound a filler density gradient is provided wherein, forexample, the filler density increases in a direction parallel to theZ-axis Z, towards the back side. The gradient may be formed by amultitude of layers of varying filler densities. The circuit devices canagain be deposited in the front side, through the layer of the secondepoxy compound having the lower filler density.

Some of the described example packagings and B-stage sheets of thisdisclosure include multiple epoxy mold compounds having different CTEs.In an example, the CTEs of the epoxy mold compounds of this descriptioncan be determined by a weight percentage of fillers in the epoxy moldcompound. For example, the CTE is inversely proportional to a fillerconcentration in the compound. In one example the first epoxy moldcompound has a weight percentage of fillers of approximately 90%,corresponding to a CTE of approximately 6 ppm/C. An example of anindustry standard epoxy mold compound having such characteristics isCEL400ZHF40W from Hitachi Chemical, Ltd®. For example the second epoxymold compound has a weight percentage of fillers of approximately 87%and a CTE of approximately 9 ppm/C. An example of an industry standardepoxy mold compound having such characteristics is CEL400ZHF40 W-87. Inother examples the weight percentage of filler in the first epoxy moldcompound can be between 87 and 91%. For example the CTE of the firstepoxy mold compound can be between approximately 6 and 9 ppm/C. Inanother example the weight percentage of filler in the second epoxy moldcompound can be between 82 and 87%. For example, the CTE of the secondepoxy mold compound is between 9 and 14 ppm/C. A different example ofdifferent CTEs of the first and second epoxy mold compound is 6 ppm/Cand 13 ppm/C, respectively. An example of a CTE of a silicon of which acircuit device may be composed is approximately 3 ppm/C.

The examples of this disclosure describe placement of an extra epoxymold compound of a relatively high CTE, next to the circuit devices.Effects of the circuit packages of this disclosure may include at leastone of reducing bow, increasing design space, and eliminating the needto add components or manufacturing process steps.

Although in different examples of this disclosure, mostly epoxy moldcompounds are described, other mold compounds may also be suitable forcompression molding and/or for providing a circuit package of thisdisclosure.

The circuit package of the various examples described in this disclosuremay be a subcomponent of a larger package or device, or an intermediateproduct of an end product. For example multiple other layers orcomponents can be attached to the back or front surface. Hence, when thecircuit package is a subcomponent, the back or front surface may not bevisible or not apparent.

The various examples of circuit packages and manufacturing methods mayrelate to integrated circuit packaging for example for computercomponents. In further examples, the packages and methods may involvefluidic applications such as 2D or 3D printing, digital titration, othermicrofluidic devices, etc.

Also the circuit package can have any orientation: the descriptive terms“back” and “front” should be understood as relative to each other only.Also, the example sheets or panels of this disclosure have a thicknessin a Z-direction and a width and length along an X-Y plane. Thethickness of the package may be relatively thin with respect to thewidth and length. In certain examples, the filler density varies overthe thickness.

What is claimed is:
 1. A method of compression molding, comprising:depositing first and second epoxy mold compounds of differentcompositions over a cavity; heating the first and second epoxy moldcompounds; depositing a circuit device having a fluid channel in thefirst epoxy mold compound such that the fluid channel is incommunication with a fluid hole of the first epoxy mold compound; andcooling the circuit device and the first and second epoxy moldcompounds.
 2. The method of claim 1, wherein the second epoxy moldcompound has a higher coefficient of thermal expansion (CTE) than thefirst epoxy mold compound.
 3. The method of claim 2, comprising:depositing a relatively thin layer of the second epoxy mold compoundover a relatively thick layer of the first epoxy mold compound.
 4. Themethod of claim 3, wherein the circuit device is disposed in a samelayer as the second epoxy mold compound.
 5. The method of claim 4,wherein the relatively thick layer of the first epoxy mold compoundextends under the circuit device.
 6. The method of claim 2, wherein thefirst epoxy mold compound has a higher weight percentage of fillers thanthe second epoxy mold compound.
 7. The method of claim 6, comprisingdepositing the first and second epoxy mold compounds so that there is agradient of filler density from a layer of the second epoxy moldcompound to a layer of the first epoxy mold compound.
 8. The method ofclaim 1, wherein depositing the circuit device includes depositing thecircuit device to protrude from the second epoxy mold compound.
 9. Themethod of claim 1, wherein depositing the first and second epoxy moldcompounds comprises depositing the first epoxy mold compound as aplurality of layers.
 10. The method of claim 9, wherein depositing thefirst and second epoxy mold compounds comprises depositing the secondepoxy mold compound between two of the plurality of layers of the firstepoxy mold compound.
 11. The method of claim 1, wherein a thickness ofthe first epoxy mold compound is greater than a thickness of the secondepoxy mold compound.
 12. A method of forming B-staged epoxy moldcompound sheets, comprising: dispensing from a first epoxy mold compoundof a first filler density to form a first layer of the first epoxy mold;dispensing from a second epoxy mold compound of a second filler densitydifferent than the first filler density to form a second layer of thesecond epoxy mold; and forming a B-staged sheet of epoxy mold compoundof varying filler density in at least one direction of the sheet. 13.The method of claim 12, comprising forming the B-staged sheet of epoxymold compound with a filler density gradient in a thickness direction ofthe sheet.
 14. The method of claim 12, comprising: depositing a firstpowder of the first epoxy mold compound; depositing a second powder ofthe second epoxy mold compound; and compressing the powders to form saidB-staged sheet.
 15. The method of claim 12, comprising: heating theB-staged sheet; depositing a circuit device on the sheet; compressingcircuit device and sheet; and cooling the circuit device and sheet.